| Plate |
Non-ablative thermal negative plate with wide operating latitude, optional post UV exposure or post baking for extremely long runs with normal and UV inks. |
| Thickness available |
0.15mm (.006”), 0.20mm (.008”), 0.30mm (.012”) and 0.40mm (.015”). |
| Spectra sensitivity |
800-850 nm |
| Platesetter compatibility |
Any suitable thermal platesetters available from Agfa, Kodak, Heidelberg, Screen and Presstek |
| Laser energy required |
75 - 125 mJ/cm2 |
| Resolution |
1% to 98 % @ 300 lpi. |
| FM capability |
20 micron stochastic. |
| Processors |
Any suitable processors for thermal positive and negative plates. |
| Developer |
Water and 1.0 % NP1 Processor Cleaner. |
| Plate finisher |
Recommended to use ML140G Plate Finisher. |
| Processing |
30 seconds dwell time at temperature between 23 and 30 °C. |
| Post UV exposure |
2 - 3 minutes under any UV exposure unit using for PS plates.
|
| Post baking conditions |
Apply ML140B Baking Gum before baking
- Static oven: 220 – 230oC for a duration of 3 – 5 minutes
- Online oven: 240oC for a duration of 4 minutes |
| Run length |
100,000 impressions unbaked and more than 1 million impressions with post UV esposed or post baked.
Actual run length may vary according to press, ink and paper conditions. |
| Safelight |
2 hours under white light and 4 hours under yellow light. |
| Shelf life |
12 months under recommended storage conditions |
| Packaging |
Available in all standard formats including bulk packaging options |
| Transport and storage |
Store plates flat in their packaging at a temperature below 25oC with relative humidity between 40 and 70% |
